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HBS-GQ-20E
HBS
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1 Product Introduction
The enclosed laser marking machine HBS-GQ-20E is a new generation laser marking system developed by our company using advanced lasers in the world. Using fiber optic output laser, the marking function is achieved through a high-speed scanning galvanometer system. The fiber laser marking machine has high electro-optical conversion efficiency, adopts air cooling method for cooling, has a small overall size, good output beam quality, and high reliability. Can carve metal materials and some non-metallic materials, mainly used in fields with high requirements for depth, smoothness, and precision, such as clocks, communication industry, bitmap marking, etc.
The closed laser marking machine HBS-GQ-20E is widely used in marking work such as plastic buttons, chargers, and transparent buttons for mobile phones. Suitable for fields with high requirements for depth, smoothness, and precision, such as clocks, bitmap images, communication industries, etc.
2 Machine Outside and size
3 Technical Parameters
1 Product Introduction
The enclosed laser marking machine HBS-GQ-20E is a new generation laser marking system developed by our company using advanced lasers in the world. Using fiber optic output laser, the marking function is achieved through a high-speed scanning galvanometer system. The fiber laser marking machine has high electro-optical conversion efficiency, adopts air cooling method for cooling, has a small overall size, good output beam quality, and high reliability. Can carve metal materials and some non-metallic materials, mainly used in fields with high requirements for depth, smoothness, and precision, such as clocks, communication industry, bitmap marking, etc.
The closed laser marking machine HBS-GQ-20E is widely used in marking work such as plastic buttons, chargers, and transparent buttons for mobile phones. Suitable for fields with high requirements for depth, smoothness, and precision, such as clocks, bitmap images, communication industries, etc.
2 Machine Outside and size
3 Technical Parameters
